On this episode of The TechArena podcast with Allyson Klein, CheePing Lee explains how Lam Research is at the forefront of pioneering solutions like high-bandwidth memory (HBM) and hybrid bonding, designed to meet the rigorous demands of artificial intelligence and next-generation applications.

CheePing discusses the critical hurdles in silicon advancement, the pivotal role of advanced packaging, and how Lam is spearheading breakthroughs to support the future of AI and chiplet ecosystems. Don't miss this insightful journey into the future of semiconductor technology.

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CheePing Lee is the senior director of Technical Program Management for Advanced Packing and Customer Operations