Clarkson University Center for Advanced Materials Processing Hosts Semiconductor Manufacturing Experts at the 26th International Symposium on Chemical Mechanical Planarization[...]

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September 4, 2024

Clarkson University's Center for Advanced Materials Processing (CAMP) hosted the 26th International Symposium on Chemical Mechanical Planarization (CMP), bringing together a record-breaking 139 industry experts and academic scholars from around the globe. Just like last year, the prestigious event took place in the picturesque setting of Lake Placid from August 11 to 14.

This year's symposium saw an unprecedented gathering of leaders in the field, with participants hailing from the United States, Japan, Korea, and various other countries. Attendees engaged in dynamic discussions on the latest advancements in CMP consumables, processes, and characterization, making it an invaluable opportunity for knowledge exchange and networking.

Clarkson welcomed distinguished representatives from top companies including GlobalFoundries, EBARA, Applied Materials, Dupont, and many others. Their presence underscored the symposium's significance as a pivotal platform for cutting-edge research and industry collaboration.

The symposium featured an impactful keynote presentation by Vidya Krishnan from GlobalFoundries. Her talk, delivered during the conference dinner, provided guests with a compelling vision of the future of the semiconductor industry, artificial intelligence, and digital integration, sparking thought-provoking conversations on emerging trends and technologies.

Another highlight of the event was the vibrant poster session, which received enthusiastic feedback from attendees. The session showcased a diverse range of innovative research, fostering stimulating discussions and insightful exchanges among participants. In addition, the student attendees benefited from an informative panel discussion on intellectual property (IP) protection, led by leaders from GlobalFoundries, IBM, and XTrinSiC. The session offered valuable insights into safeguarding innovations in the rapidly evolving tech landscape, equipping the next generation of engineers with critical knowledge for their future careers.

The 26th International Symposium on CMP was a resounding success, marked by robust participation, insightful presentations, and meaningful exchanges of ideas. CAMP looks forward to continuing its tradition of excellence in future symposia.

For more information about the symposium and future events hosted by CAMP, please visit clarkson.edu/camp or contact [email protected].