Material Agreement Form 8 K

Item 1.01 Entry into a Material Definitive Agreement

On July 16, 2024, S&W Seed Company (the "Company") entered into a Fourth Amendment to Subordinate Loan and Security Agreement (the "MFP Amendment") with MFP Partners L.P. ("MFP"), amending the Company's Subordinate Loan and Security Agreement, dated September 22, 2022 (as amended, the "MFP Loan Agreement"), with MFP, to (i) extend the maturity date of the letter of credit to November 30, 2024 and (ii) extend the maturity date of the MFP Loan Agreement to May 31, 2025. Except as modified by the MFP Amendment, all terms and conditions of the MFP Loan Agreement remain in full force and effect.