Foxconn Interconnect Technology Ltd.
Foxconn Interconnect Technology Ltd.
10/07/2024 | Press release | Distributed by Public on 10/06/2024 21:55
Foxconn Interconnect Technology showcases AI data center connectivity solutions at HHTD24 Hon Hai Technology Day
[Taipei/Hong Kong - October 7, 2024] Foxconn Interconnect Technology (FIT, 6088-HK), a subsidiary of Foxconn Technology Group (2317-TW), participated in the annual flagship event HHTD24 (Hon Hai Tech Day 2024. At this event, FIT showcased a range of innovative products with a primary focus on AI data centers and smart automotive solutions.
At the AI Data Center exhibition area, FIT introduced a variety of high-performance products, ranging from innovative concept displays to mass-production-ready technologies and solutions. These showcased the company's strong capabilities in product development, technical advantages, and creative design, solidifying its leadership in the connector industry. One highlight was the high-current connectors and cables, along with liquid cooling quick connectors, which attracted significant attention. In addition to meeting standard regulations, these solutions cater to the next-generation AI racks' demands for enhanced heat dissipation and current transmission, improving system stability and cooling efficiency.
Moreover, FIT is leading the way in technological advancements by collaborating with partners to develop the CPO (Co-Packaged Optics) high-speed interconnect solutions. These solutions, which utilize advanced silicon photonics technology, significantly improve data transmission efficiency and reduce signal attenuation, providing robust support for AI applications. In terms of innovation, FIT's conceptual FITConn 800G high-speed connector module, a Red Dot Design Award winner, made its physical debut, showcasing a groundbreaking design that eliminates data loss during transmission and dramatically enhances connectivity performance.
In the smart automotive sector, FIT's innovative products are designed to enhance driver safety and convenience. First, the Smart Access System uses digital key technology, allowing users to unlock and start their vehicles with a simple tap on their smartphones, eliminating the need for physical keys and reducing the risk of unauthorized access. The HMI/Dashboard platform offers real-time vehicle monitoring, empowering users with greater control. Meanwhile, the mmWave Radar Module can detect potential hazards in real time, ensuring driving safety. The Biometric Monitoring System incorporates biometric technology to comprehensively monitor drivers' health, helping users make proactive health decisions. Together, these cutting-edge products reinforce FIT's leadership in the smart automotive field.
In addition to technological innovations in AI data centers and smart automotive solutions, FIT's Belkin products were selected as guest gifts for this event, showcasing the endless possibilities for the future of smart living. The company remains committed to advancing technology and providing more efficient and secure solutions for customers worldwide.
At the AI Data Center exhibition area, FIT introduced a variety of high-performance products, ranging from innovative concept displays to mass-production-ready technologies and solutions. These showcased the company's strong capabilities in product development, technical advantages, and creative design, solidifying its leadership in the connector industry. One highlight was the high-current connectors and cables, along with liquid cooling quick connectors, which attracted significant attention. In addition to meeting standard regulations, these solutions cater to the next-generation AI racks' demands for enhanced heat dissipation and current transmission, improving system stability and cooling efficiency.
Moreover, FIT is leading the way in technological advancements by collaborating with partners to develop the CPO (Co-Packaged Optics) high-speed interconnect solutions. These solutions, which utilize advanced silicon photonics technology, significantly improve data transmission efficiency and reduce signal attenuation, providing robust support for AI applications. In terms of innovation, FIT's conceptual FITConn 800G high-speed connector module, a Red Dot Design Award winner, made its physical debut, showcasing a groundbreaking design that eliminates data loss during transmission and dramatically enhances connectivity performance.
In the smart automotive sector, FIT's innovative products are designed to enhance driver safety and convenience. First, the Smart Access System uses digital key technology, allowing users to unlock and start their vehicles with a simple tap on their smartphones, eliminating the need for physical keys and reducing the risk of unauthorized access. The HMI/Dashboard platform offers real-time vehicle monitoring, empowering users with greater control. Meanwhile, the mmWave Radar Module can detect potential hazards in real time, ensuring driving safety. The Biometric Monitoring System incorporates biometric technology to comprehensively monitor drivers' health, helping users make proactive health decisions. Together, these cutting-edge products reinforce FIT's leadership in the smart automotive field.
In addition to technological innovations in AI data centers and smart automotive solutions, FIT's Belkin products were selected as guest gifts for this event, showcasing the endless possibilities for the future of smart living. The company remains committed to advancing technology and providing more efficient and secure solutions for customers worldwide.