01/10/2024 | Press release | Distributed by Public on 01/09/2024 22:13
January 10, 2024
TDK Corporation (TSE:6762) announces the InvenSense SmartEdgeMLTM, an advanced edge ML solution enabling new possibilities for wearables, hearables, AR glasses, IoT, and other products that benefit from machine learning (ML) at the sensor chip level. SmartEdgeML is the first solution to generate and run machine learning models on a 2.5 x 3mm 6-axis motion sensor IMU at < 30 µA.
"TDK's SmartEdgeML is a paradigm shift in edge machine learning, as it will allow developers, ODMs, and OEMs to implement ML-optimized motion sensor algorithms on an IMU sensor chip. This reduces the amount of raw data going to edge processors, which significantly improves device battery life, data privacy, and system latency," said Sahil Choudhary, Director Motion Sensors and Software at InvenSense, a TDK Group company.
TDK also announces the availability of the InvenSense SmartBug 2.0 (MD-45686-ML), a multi-sensor wireless module consisting of the InvenSense ICM-45686-S IMU. This module works as the perfect evaluation system for users to get started with the InvenSense SIF and the ICM-45686-S IMU. The SIF is now available for download, while the MD-45686-ML and ICM-45686-S will be available at distributors by February 1, 2024.
There are three components of SmartEdgeML, which include:
SmartEdgeML is being demonstrated at this week's Consumer Electronics Show (CES) in Las Vegas from January 9-12, 2024. Come by the TDK booth #20521 in the CES Central Hall (LVCC) and look for the demo: "SmartEdgeML Machine Learning on a Chip" where you can build a machine learning algorithm on a 2.5*3 mm motion sensor in less than five minutes.
For more information about SmartEdgeML including the SmartBug 2.0, and to download the SIF software, visit invensense.tdk.com/smartedgeml or contact InvenSense Sales at [email protected].
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About TDK Corporation
TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately "Attracting Tomorrow." It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2023, TDK posted total sales of USD 16.1 billion and employed about 103,000 people worldwide.
About InvenSense
InvenSense, a TDK Group company, is a world-leading provider of Sensing Solutions. InvenSense's vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, Pressure, and Ultrasonic solutions. InvenSense's solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, barometric pressure sensors, and ultrasonic time-of-flight sensors with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense's motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, IoT, Robotics, and many more types of products. InvenSense became part of the MEMS Sensors Business Group within the Sensor Systems Business Company of TDK Corporation in 2017. In April of 2022, Chirp Microsystems formally merged with InvenSense. InvenSense is headquartered in San Jose, California and has offices worldwide.