u blox launches tri radio module that delivers the latest wireless technologies for IoT implementations

Press releases

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12 Nov 2024

The u-blox MAYA-W4 combines Wi-Fi® 6, Bluetooth® LE 5.4 and 802.15.4 for reliable, ubiquitous and secure connectivity for the IoT ecosystem.

Thalwil, Switzerland - November 12, 2024 - u-blox (SIX:UBXN), a global leader in wireless and positioning technologies, announces the launch of the MAYA-W4, a cost-efficient tri-radio module that delivers the latest in wireless connectivity technologies for the mass market. With support for dual-band Wi-Fi 6, Bluetooth Low Energy 5.4, and 802.15.4 (for Thread supporting Matter), the MAYA-W4 is set to redefine the landscape of IoT applications in diverse industries, enhancing device connectivity and interoperability.

Combining three of the most critical wireless technologies into a compact, power-efficient module, the versatile MAYA-W4 meets the growing demand for reliable and secure connectivity. Whether enabling low-energy mesh networks for smart homes or providing high-speed Wi-Fi 6 connectivity for industrial tools, the MAYA-W4 offers unparalleled flexibility for developers and manufacturers. Its small size and robust design make it ideal for space-constrained applications, while its comprehensive global certifications ensure seamless deployment across regions.

The MAYA-W4 addresses the market's need for Wi-Fi 6 solutions, driven by the rapid adoption of Wi-Fi 6 in IoT segments, as highlighted by recent market data from TSR* (Techno Systems Research CO. LTD.). It alleviates network congestion, enhances power efficiency, and, with a temperature range of -40°C to +85°C, is suitable for industrial environments. With its entry-level feature set and optimized data throughput, the MAYA-W4 offers cost-efficient connectivity without compromising performance. The inclusion of 802.15.4 enables low-power IoT and mesh networking, providing a gateway for the next generation of smart, connected devices.

The new module also eases design efforts, enabling manufacturers to scale their device designs for current and future markets. Offering a selection of antenna variants, designers can choose between pin(s) out, embedded antenna, or U.FL. connector(s) configuration. By maintaining the same compact dimensions as its predecessors (10 x 14 x 1.9 mm), u-blox simplifies migration across previous generations.

"The u-blox tri-radio MAYA-W4 module integrates our newly announced NXP® Semiconductors IW610 chipset to deliver the latest wireless connectivity technologies to additional segments such as industrial, medical, and consumer," says Larry Olivas, Vice President and General Manager, Wireless Connectivity Solutions at NXP. "As a Gold Partner and part of our broader market strategy, u-blox is instrumental in making robust connectivity and an advanced feature set available to our broad market customers. We are excited about the MAYA-W4 and u-blox's commitment to NXP as a strategic connectivity partner."

Samples are available now, with volume production scheduled for the second half of 2025.

*TSR is a global business analyst group headquartered in Japan.

u-blox (SIX:UBXN) provides semiconductor chips, modules, and IoT services that reliably locate and connect every thing. Our cutting-edge solutions drive innovation for the car of the future and the Internet of Things. Headquartered in Thalwil (Zurich), Switzerland, we have a global presence of 1,400 experts who enable our customers to build solutions for a precise, smart, and sustainable future.

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u-blox media contact:
Sven Etzold
Senior Director Business Marketing
Mobile +41 76 561 0066
[email protected]