11/21/2024 | Press release | Distributed by Public on 11/22/2024 10:49
SAN JOSE, CA - U.S. Representatives Zoe Lofgren (CA-18), Ranking Member of the House Science, Space, and Technology Committee, Ro Khanna (CA-17), Anna Eshoo (CA-16), and Jimmy Panetta (CA-19), co-authors of the CHIPS and Science Act, announced that Applied Materials in Santa Clara, CA has been awarded $100 million in federal funding through the CHIPS Research and Development Office's National Advanced Packaging Manufacturing Program.
"Companies like Applied Materials in Silicon Valley are helping America be a world leader in semiconductors. The $100 million in federal funding made possible through the CHIPS and Science Act for Applied Materials will invest in innovative research to develop advanced packaging and support technologies such as next-generation energy-efficient AI. We were proud to champion the CHIPS and Science Act in Congress and will continue advocating for investments that allow our country to lead in the global economy and technologies of the future," said Representatives Lofgren, Khanna, Eshoo, and Panetta.
"We welcome the Department of Commerce decision to invest in advanced packaging research projects through CHIPS for America. With this CHIPS Act investment, Applied Materials will work to produce a disruptive silicon-core substrate technology that can be used to package and integrate multiple chips in new ways to achieve more energy-efficient computing," said Dr. Om Nalamasu, Senior Vice President and CTO of Applied Materials.
This funding is part of $300 million announced by the U.S. Department of Commerce through the CHIPS and Science Act for advanced packaging research projects in Georgia, California, and Arizona to develop technologies key to the semiconductor industry that are not currently produced in the United States.
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