IBM - International Business Machines Corporation
07/23/2024 | Press release | Distributed by Public on 07/23/2024 21:10
ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
July 23, 2024
ASMPT and IBM announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.