SECO at Embedded World North America 2024

SECO Showcases Technologies for Embedded Computing and Edge AI at EW North America 24

Arezzo, Italy, September 26, 2024 - SECO, a leader in embedded computing and IoT software solutions, will exhibit at embedded world North America in Austin, Texas, from October 8-10, 2024. This inaugural U.S. event from the organizers of embedded world Exhibition&Conference, annually held in Nuremberg, Germany, offers an invaluable opportunity for visitors to explore SECO's solutions for the North American market, supported by the company's U.S.-based engineering and operations.

At booth #2315, SECO will showcase its range of embedded hardware products as well as Clea, its IoT software suite. Visitors will also see demos of SECO's edge AI capabilities that highlight the company's partnerships with leading technology providers such as Qualcomm® and Axelera AI.

Product Highlights

SECO offers a broad range of embedded computing and rugged smart display electronic products. The versatile Modular Vision series human-machine interface (HMI) panel PCs based on a selection on Arm and x86 processors include touch displays, wired and wireless networking, and industrial peripheral interfaces. Standard screen sizes of 7", 10.1", and 15.6" provide up to 4K resolution.

Based on Qualcomm®, NXP, Intel®, and MediaTek processors across x86 and Arm architectures, SECO offers a wide selection of off-the-shelf computing modules, from single board computers (SBCs) to standard form factor computing modules (CoMs/SoMs). Amongst others, booth visitors will be able to see the SOM-SMARC-MX93, SOM-COMe-BT6-RPL-P, SOM-COM-HPC-A-MTL, and SBC-pITX-EHL.

SECO also offers fully packaged industrial PCs. Optimized for high reliability, flexibility, and security, these certified boxed solutions offer a wide range of performance capabilities. The new Palladio 500 RPL, Modular Link MX93, and Titan 300 TGL-UP3 AI will be featured at embedded world North America.

SECO will also present two new development kits for SMARC CoMs, with a focus on hosting its Qualcomm processor module, the SOM-SMARC-QCS6490. The SMARC Qualcomm® Starter Kit, featuring an industrial 3.5" form-factor carrier board, provides multiple interfaces and accommodates mPCIe and M.2 plug-in modules. This kit focuses on rapid proof of concept implementation and accelerates product development.

The second development kit focuses on early prototyping and software development. With a larger format carrier that breaks out additional functionality, this kit is ideal for experimentation, software development, and fine-tuning product architectures prior to implementing a product-specific carrier.

All SECO hardware products work seamlessly with Clea, the software suite that powers IoT infrastructure. Fully open source and compatible with any cloud provider or on-premises infrastructure, Clea makes it easy to harness operational data, remotely manage infrastructure, and facilitate value-added services and AI applications. Clea OS, a new addition to the Clea software suite, facilitates the deployment of edge IoT devices. This industrial-grade embedded Linux operating system, built on the open-source Yocto Project, seamlessly integrates with the cloud and allows engineers to focus on accelerating product development with its easy system configuration. Clea OS is compatible with both SECO edge products and third-party hardware.

Demos Highlight SECO's Edge AI Capabilities

In addition to its comprehensive product offering, visitors will have the chance to see two demonstrations of SECO's edge AI development and deployment capabilities. The first demo features the building blocks of edge AI-driven security and situational management. The Palladio 500 RPL embedded computer with its 13th Gen Intel® Core™ processor, integrated with an Axelera Metis AIPU, performs real-time video analysis and AI-powered feature extraction from multiple live camera feeds.

The second demo shows the emerging technology of running Large Language Model (LLM) AI at the edge, developed with SECO's team of data scientists and AI experts. Without processing support from the cloud, edge LLMs will run autonomously without network connectivity, minimize result latency, and enhance information security.

SECO will be at booth #2315 at embedded world North America in Austin, TX from October 8-10, 2024. To schedule a meeting or learn more about SECO, visit seco.com.

SECO

SECO (IOT.MI) is a high-tech company that develops and manufactures cutting-edge solutions for the digitalization of industrial products and processes. SECO's hardware and software offerings enable B2B companies to easily introduce edge computing, Internet of Things, data analytics, and artificial intelligence to their businesses. SECO's technology spans across multiple fields of application, serving more than 450 clients across sectors such as medical, industrial automation, fitness, vending, transportation, and many others. Through live monitoring and smart control of in-the-field devices, SECO solutions contribute to low environmental impact business operations via a more efficient use of resources.

For more information:

www.seco.com

[email protected].